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John Lau; Kuo-Ning Chiang978-981-95-6891-82026 Edition 1- Contains in-depth coverage of Cu interconnects, glass substrates, 3D PIC/EIC integration, fatigue, FE, machine learning
- Provides studies on chiplets and heterogeneous integration: design, materials, process, reliability, modeling, AI model
- Authored by contributors from leading industrial and academic institutions
€400 €36010% OFF