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  • From Architectures to Applications
    Yan Li; Deepak Goyal
    978-981-15-7090-2
    2021
    Edition 2
    • Provides comprehensive coverage of 3D microelectronic packages
    • Explains the fundamentals of using solder interconnects as micro-bumps
    • Demonstrates the advanced materials and processes used in 3D microelectronic packages
    • Introduces readers to the 3D microelectronic package architecture and assembly process design
    • Highlights quality and reliability concerns in 3D packaging
    • Offers a detailed review of fault isolation and failure analysis in 3D packaging

    €320

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