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  • Qingke Zhang
    978-3-662-48823-2
    2016
    Edition 1
    • the Chinese Academy of Sciences as an outstanding thesis in the field
    • damage behavior of a series of Pb-free solder joints under different loading
    • In-situ characterization techniques are used to reveal the dynamic damage process in solder joints
    • The fracture behavior and fracture strength of the Cu-Sn intermetallic compound are tested
    • Includes supplementary material: sn.pub/extras

    €100

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