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From Particle Scale to Feature, Die and Wafer ScalesJianfeng Luo; David A. Dornfeld978-3-662-07928-72004 Edition 1- First book dedicated to the modeling of CMP for sub-micron integrated circuit (IC) fabrication
- Modeling and simulation are critical to transfer CMP from an engineering ‘art’ to an engineering ‘science’
€280 €25210% OFF