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Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

Materials, Processes, Equipment, and Reliability

Kim S. Siow

978-3-319-99256-3

2019
Edition 1
- Addresses the differences between sintering and soldering (the current die-attach technologies) thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials.
- Emphasizes the industrial perspective with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium.
- Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field
€400

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