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  • Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
    Seonho Seok
    978-3-319-77872-3
    2018
    Edition 1
    • Introduces a new and unique packaging technology
    • Explains microelectromechanical systems (MEMS) packaging utilizing polymers or thin films
    • Discusses finite element method (FEM) modeling to explain the technology from a theoretical perspective as well as offering practical information

    €260

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