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  • Ken Kuang; Rick Sturdivant
    978-3-319-51697-4
    2017
    Edition 1
    • Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis
    • Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies
    • Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers
    • Includes supplementary material: sn.pub/extras

    €240

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