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  • From Fundamentals to Applications
    Yan Li; Deepak Goyal
    978-3-319-44586-1
    2017
    Edition 1
    • Provides comprehensive coverage of the state-of-the-art in 3D microelectronic packages
    • Covers advanced materials and processes, quality and reliability concerns, and fault isolation and failure analysis
    • Discusses 3D electronic package architecture and assembly process design
    • Features contributions from both academic and industry authors, for a complete view of this important technology
    • Includes supplementary material: sn.pub/extras

    €340

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