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United Nations Sustainable Development Goals (SDGs)
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From Emerging Processes to Heterogeneous SystemsIbrahim (Abe) M. Elfadel; Gerhard Fettweis978-3-319-20481-92016 Edition 1- Provides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systems;
- Explains the use of wireless 3D integration to improve 3D IC reliability and yield;
- Describes techniques for monitoring and mitigating thermal behavior in 3D ICs;
- Includes discussion of 3D integration of high-density power sources and novel NVM.
- Includes supplementary material: sn.pub/extras
€100