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  • Processing, Materials, and Applications
    Kazuo Kondo; Morihiro Kada; Kenji Takahashi
    978-3-319-18675-7
    2015
    Edition 1
    • Gives instruction on how to build three-dimensional interconnects
    • Introduces materials and processing for three-dimensional packaging
    • Discuss many applications of three-dimensional packaging
    • Includes supplementary material: sn.pub/extras

    €180

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