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  • Kazuo Nojiri
    978-3-319-10295-5
    2015
    Edition 1
    • Provides a comprehensive, systematic guide to dry etching technologies, from basics to latest technologies
    • Enables beginners to understand the mechanisms of dry etching, without complexities of numerical formulas/equations
    • Describes etching processes for all materials which are used in semiconductor devices, explains key etching parameters for each material, and explains why a particular plasma source and etching gas chemistry is used for each material
    • Discusses the device manufacturing flow and explains in which part of device manufacturing dry etching is actually used
    • Describes the types and plasma generation mechanism of etching equipment which are actually used in semiconductor fabs, such as CCP (Capacitively Coupled Plasma), Magnetron RIE (Magnetron Reactive Ion Etching), ECR (Electron Cyclotron Resonance) Plasma, and ICP (Inductively Coupled Plasma)
    • Includes supplementary material: sn.pub/extras
    €200 €180
    10% OFF

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