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  • Preeti S Chauhan; Anupam Choubey; ZhaoWei Zhong; Michael G Pecht
    978-1-4614-5761-9
    2014
    Edition 1
    • Introduces copper wire bonding technologies
    • Presents copper wire bonding processes
    • Discusses copper wire bonding metallurgies
    • Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes
    • Covers the reliability tests and concerns
    • Covers the current implementation of copper wire bonding in the electronics industry
    • Features 120 figures and tables
    • Includes supplementary material: sn.pub/extras

    €240

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