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  • Nauman Khan; Soha Hassoun
    978-1-4614-5508-0
    2013
    Edition 1
    • Introduces readers to challenges and best practices in designing TSVs for 3D integrated circuits
    • Discusses how TSVs induce noise affecting neighboring devices, provides a methodology to evaluate noise and evaluates several techniques to eliminate and reduce TSV noise
    • Investigates the impact of TSV size and granularity on power delivery for 3D ICs within a novel framework that considers architectural setups and benchmarks
    • Explores the use of Carbon Nanotubes for power grid design
    €100 €90
    10% OFF

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