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  • Design, Assembly Process, Reliability and Modeling
    Yong Liu
    978-1-4614-1053-9
    2012
    Edition 1
    • Explains numerous types of electronic packaging design, including power discrete packaging, power IC packaging and power wafer level CSP
    • Provides the reader with a fundamental understanding of the evolution of power packaging, while also predicting future development trends in monolithic and hybrid integrations
    • Presents the most advanced simulation and modeling methodologies in electronic packaging design, reliability, and assembly to insure that practicioners can fully test their power electronic packaging designs
    • Includes supplementary material: sn.pub/extras

    €478

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