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  • Mechanics and Reliability
    John Hock Lye Pang
    978-1-4614-0463-7
    2012
    Edition 1
    • Discusses lead-free solder materials industry their selection and how they are currently used industry wide
    • Focuses on mechanics of materials theory in elastic, plastic, creep, fatigue and fracture assessments
    • Presents materials testing and characterization at the macro, micro, and nano scale
    • Details how to use reliability test and analysis for thermal cycling, cyclic bending and drop impact
    • Includes supplementary material: sn.pub/extras

    €180

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