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Solder Joint Reliability Prediction for Multiple Environments

Andrew E. Perkins; Suresh K. Sitaraman

978-0-387-79394-8

2009
Edition 1
- Provides a comprehensive summary of current literature on lead-containing ceramic area array electronic package solder joining reliability
- Develops useful and easy-to-use tools for predicting solder joint fatigue life under thermal cycling and power cycling environments. Offers insight into how to relate accelerated thermal cycling testing conditions to real world applications
- Offers new insight into solder joint reliability testing under multiple environments, including vibration environments
- Develops a methodology for predicting solder joint reliability using numerical simulations and experimental data under multiple environments that can be related to any package type
€180

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