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  • Daniel Lu; C.P. Wong
    978-0-387-78219-5
    2009
    Edition 1
    • Provides a comprehensive summary of the most recent advances in materials development for advanced packaging
    • Covers emerging technologies such as digital health, bio-medical, and nano-materials / processing, in addition to microelectronic and optoelectronic packaging
    • Discusses various types of materials including polymers, ceramics, metals, and solders
    • Each chapter written by industry leaders

    €320

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