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  • Chuan Seng Tan; Ronald J. Gutmann; L. Rafael Reif
    978-0-387-76534-1
    2008
    Edition 1
    • Focuses on the foundry-based process technology for the fabrication of 3-D ICs
    • Discusses the technology platform for pre-packaging wafer level 3-D ICs
    • Includes chapters contributed by various experts in the field of wafer-level 3-D ICs process technology

    €280

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