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  • Nanotechnologies and Electronics Packaging
    James E. Morris
    978-0-387-47326-0
    2008
    Edition 1
    • Offers a comprehensive discussion of Nanoparticles and Carbon Nanotubes, and how and why they are rapidly becoming materials options for electronics packaging
    • Discusses the importance of computer modeling in nanopackaging and offers suggestions for implementation
    • Discusses Nanoparticles and their role in packaging, including basic properties and fabrication, and applications in resistors, capacitors, inductors, microvias and conductive adhesives, solder, underfill, and thermal management
    • Discusses Carbon Nanotubes and their role in packaging, including basic properties and fabrication, and applications in solder, thermal management, and EMI control
    • Brings together a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends
    • Includes supplementary material: sn.pub/extras

    €400

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