"eBook ISBN","Title","Subtitle","Authors/editors","Copyright year","Edition","DOI","Price (EUR)","Additional info"
"978-3-662-07928-7","Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication","From Particle Scale to Feature, Die and Wafer Scales","Jianfeng Luo; David A. Dornfeld",2004,"1","https://doi.org/10.1007/978-3-662-07928-7",280,""