"eBook ISBN","Title","Subtitle","Authors/editors","Copyright year","Edition","DOI","Price (EUR)","Additional info"
"978-1-4615-3528-7","Solder Paste in Electronics Packaging","Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly","Jennie Hwang",1992,"1","https://doi.org/10.1007/978-1-4615-3528-7",180,""